Device: MX29LA641DH [CSP64]
Manufacturer: Macronix
Part number description for this device:
Move the cursor over the box to highlight particular section| MX | Macronix | |
| XX | Device Number | 26 = High speed eLiteFlash memory 28 = FLASH 29 = Single Voltage FLASH 68 = Stack die Flash |
| X | Process | C = CMOS Flash F = 5V Flash L, LV = Low-Voltage, 3.3V Flash LW = Lov-Voltage, 3.3V Pagemode Flash LA = 3V Security BL = 3V with Write Buffer GL = 3V Page mode GA = 3V Security Flash V = 2.2V U, SL = 1.8V NS, VS = 1.8V Burst Mode X = 1.5V |
| XXXX | Capacity & Mode | 004 = 512kx8, Boot block 040 = 512kx8, Equal sector 008 = 1Mx8, Boot block 080, 081 = 1Mx8, Equal sector 100 = 128kx8 / 64kx16 200 = 256kx8 / 128kx16 400, 401 = 512kx8 / 256kx16, Boot Block 800 = 1Mx8 / 512kx16 1610, 1611, 1615, 160, 161 = 2Mx8 / 1Mx16 3211, 320 = 4Mx8 / 2Mx16 640 = 8Mx8 / 4Mx16 641 = 4Mx16 001 = 128kx8 002, 002N = 256kx8 022, 022N = 256kx8 1000, 1000P = 128kx8 2000T, 2000P = 256kx8 2100 = 128kx16 8000 = 1Mx8 8100, 8100G, 800 = 1Mx8 / 512kx16 016, 017 = 2Mx8 033 = 4Mx8, Equal sector 161 = 2Mx8 / 1Mx16 or 1Mx16 321 = 8Mx8 / 2Mx16 065 = 8Mx8, Equal sector 402 = 4Mb x8/x16 boot block 128, 129 = 128Mb x8/x16 boot block 256 = 256Mb x8/x16 uniform block 257 = 256Mb x16 uniform block 1G0 = 1Gb x8/x16 architecture |
| X | Version | Blank A = A-version B = B-version C = C-version D = D-version M = M-version E = E-version F = F-version |
| X | Sector Architecture | Blank T = Top boot sector B = Bottom boot sector U = Equal sector H = High sector L = Low sector C = Highest address sector protected with read protection F = Lowest address sector protected with read protection XJ = TFBGA, 0.5mm pitch, 0.3mm ball size |
| X | Package Type | P = Plastic DIP C = Ceramic DIP K = Skinny DIP M = Plastic SOP Q = PLCC D = CerDIP F = Plastic QFP T = TSOP R = TSOP reverse X = FBGA(CSP) XB = TFBGA(CSP), 0.8 mm ball pitch / 0.3 mm ball size XC = FBGA(CSP), 1.0mm ball pich XE = LFBGA, FBGA(CSP), 0.8 mm ball pitch / 0.4 mm ball size XF = LFBGA (11mm x 13mm) XG = TBGA(CSP), 0.8 mm ball pitch / 0.4 mm ball size XH = WFBGA, 0.5mm ball pitch, 0.3mm ball size XJ = TFBGA56 (7.7x6.2mm),0.5mm pitch/0.3mm ball size XL = TFBGA56 (7.7x6.2x1.05nn) GB = XFLGA, 0.5mm land pitch, 0.25mm land opening |
| X | Temperature Range | C = Commercial I = Industrial M = Military |
| XX | Speed Option | 45 = 45 ns 55 = 55 ns 70 = 70 ns 80 = 80 ns 90 = 90 ns 10 = 100 ns 11 = 110 ns 12 = 120 ns 15 = 150 ns 20 = 200 ns |
| X | Option | Blank G = Lead-free package Q = RoHS compliant; Vcc=3.0V to 3.6V |
| XX | Cycling (FLASH) | Blank C3 = 1000 C4 = 10000 C5 = 100000 |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
go back to result pageSupported by programmers and programming adapters/modules:
| BeeHive204 | adapter/module: BGA-0777/0259 (70-0777/0259) = BGA-Bottom-88 (70-0777) + BGA-Top-5 ZIF-CS (70-0259) |
| BeeHive208S | adapter/module: BGA-0777/0259 (70-0777/0259) = BGA-Bottom-88 (70-0777) + BGA-Top-5 ZIF-CS (70-0259) |
| BeeProg2 | adapter/module: BGA-0777/0259 (70-0777/0259) = BGA-Bottom-88 (70-0777) + BGA-Top-5 ZIF-CS (70-0259) |
| BeeProg2C | adapter/module: BGA-0777/0259 (70-0777/0259) = BGA-Bottom-88 (70-0777) + BGA-Top-5 ZIF-CS (70-0259) |
